Week In Review: Manufacturing, Test

On Sunday, a 6.8 magnitude earthquake struck the southeastern region of Taiwanwreak havoc. TSMC Officials reported “no known significant impacts for now.” market research company TrendForce came to a similar conclusion based on his analysis of individual fabs.

That Biden administration announced the appointment of the leadership team tasked with implementing the US CHIPS and Science Act, led by Aaron “Ronnie” Chatterji, the White House coordinator for CHIPS implementation. Other members are Michael Schmidt, head of the CHIPS program office; Eric Lin, Interim Director, CHIPS Research and Development Office; Todd Fisher, Senior Interim Advisor, CHIPS Program Office; Donna Dubinsky, Senior Counselor to the Secretary for CHIPS Implementation; and JD Grom, senior advisor to the Secretary for CHIPS implementation.

NVIDIAJensen Huang, CEO of , explained at the recent GPU Technology Conference (GTC) that Moore’s Law is no longer driving the semiconductor process. “Moore’s Law is dead. Moore’s Law’s ability to deliver twice the performance for the same price or the same performance and half the cost every year and a half is gone. It’s completely over,” Huang said. He named stacked designs as the future.

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That American Semiconductor Innovation Coalition (ASIC) — the group advocating for an efficient center of innovation from the National Semiconductor Technology Center (NSTC) and National Advanced Packaging Manufacturing Program (NAPMP) funded by the CHIPS and Science Act — has expanded its reach to include members, covering all phases of the chip manufacturing supply chain. One goal is to build semiconductor R&D facilities in six months. New members of ASIC include Nvidia, DuPontand GlobalFoundrieswho join Analog Devices, IBM, Microsoft, micron, WITH, Synopsysand other.

TSMC is involved in an R&D project led by NVIDIA to use its silicon photonics integration technology called COUPE (Compact Universal Photonic Engine) for graphics hardware, which sources say combines multiple AI GPUs.

AMD Chairwoman and CEO Lisa Su is planning a visit Taiwan Early October to meet key suppliers including TSMC and ASE.

Singapore‘s single tel is working with Intel to set up a 5G Multi-Access Edge Compute (MEC) incubator.

Siemens Digital Industries software and United Microelectronics (UMC) are collaborating to develop and implement a new multi-chip 3D IC planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer bonding technologies to implement. UMC plans to offer this new flow to its customers soon.

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Synopsys now offers a uniform hardware system for emulation and prototyping based on the Synopsys ZeBu EP1 emulation system. By adding prototyping functionality to Synopsys ZeBu EP1, a Billion Gates emulation system, customers can benefit from a single verification hardware system throughout their chip development lifecycle.

Brewer Science organizes the “Manufacturing Day 2022” on October 7th.thwhich will feature an open house and tours of the high volume manufacturing facility in Vichy, MO.

IBM announced acquisition plans dialexaa leading US digital product development services company.

equipment and materials

proteanTecs has joined it UCIe (Universal Chiplet Interconnect Express) consortium to introduce interconnect condition monitoring to the expanding advanced packaging ecosystem.

market research

Corresponding counterpoint research, Qualcomm dominates the chipset market with >80% market share. The company claims Qualcomm’s strong product portfolio and partnerships with Tier 1 suppliers and automakers will help Qualcomm. they expect MediaTek and Samsung to increase market share in automotive 5G connectivity.


A research team led by Professor Junwoo Son and Dr. Minguk Cho (Department of Materials Science and Engineering) at South Korea‘s POSTECH succeeded in maximizing the switching efficiency of oxide semiconductor devices by inserting platinum nanoparticles.

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researchers at the University of Michigan developed a new nanophotonic material that is stable at temperatures of 1,100 °C in air. This heterostructure of perovskite BaZr0.5hp0.5O3 (BZHO) and rock salt MgO or similar materials may prove useful in solid state energy conversion.

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Check out the latest Test, Measurement & Analytics and Manufacturing, Packaging & Materials newsletters for these highlights and more:

Upcoming Events:

  • SPIE Photomask Technology/Extreme Ultraviolet Lithography, September 25-29 (Monterey, CA)
  • International Testing Conference: ITC 2022, Sept. 25-30 (Anaheim, CA)
  • IEEE/ACM International Symposium on Microarchitecture, 1.-5. Oct (Chicago, IL)
  • Samsung Foundry Forum & SAFE Forum 2022 GLOBAL, 3-21 Oct (5 countries)
  • iMAPS-55. International Symposium on Microelectronics, Oct 3-6 (Boston, MA)
  • Semicon China, 5th-7th Oct (Shanghai, China)
  • SEMI Pacific Northwest Forum, Nov 3 (Beaverton, OR)

Karen Heyman

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Karen Heyman is the technology editor at Semiconductor Engineering.

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